Abstract: Integrated Sensing and Communication (ISAC) has emerged as a key enabler for future wireless systems. The recently developed symbol-level precoding (SLP) technique holds significant ...
Abstract: Advanced fan-out wafer-level packaging (FOWLP) has become a key enabler for high-performance computing (HPC) and artificial intelligence (AI) systems, offering high-density and heterogeneous ...
DesignCon 2027 is looking for new ideas in signal and power integrity, high-speed processing, photonics, wireless electronics ...
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