With the consumer electronics market approaching saturation, panel manufacturers from Taiwan and China are seeking new avenues for growth. Firms like BOE and Innolux are shifting toward advanced ...

Facing price competition pressure from China, Taiwan's display panel industry is encountering growing operational challenges. However, the surge in AI chip demand for advanced packaging has opened a ...

TSMC is preparing to mass-produce panel-level packaging (PLP), a next-generation chip-packaging technology — setting up a direct contest with Samsung Electronics, which entered the field earlier.

The race is on to build the massive chip packages that power the future of AI, with some technologies being developed to produce a single chip that houses a monstrous 58 chips in one unit. But the ...