Taiwan Semiconductor Manufacturing Co (TSMC) and US-based chip packaging and testing provider Amkor Technology have signed a 10-year agreement aimed at expanding advanced semiconductor packaging and ...

Modi opens CG Semi's $870m Sanand OSAT plant, packaging 200 million chips a year at launch as India's semiconductor mission gathers pace.

Advanced packaging allows multiple small chips to be connected, protected and tested to create a final larger chip like a graphics processing unit. Nvidia has reserved the majority of capacity at ...

Sixteen miles north of Albuquerque, in Rio Rancho, New Mexico, an Intel chip plant sits on more than 200 acres of land. The site was established in the 1980s, part of it built on top of a sod farm. In ...