UK-based Dynex Semiconductor has announced the development of a new 450A, 650V GaN half-bridge power module, designed to ...

SEMI and TechSearch International today announced the release of the 2026 edition of the Worldwide Assembly & Test Facility Database, a comprehensive resource tracking semiconductor back-end ...

Q: Are chiplets simply an evolution of multi-chip modules (MCMs) from the 1990’s? A: In many ways, yes. Early multi-chip ...

A new technical paper titled “A color-coded light-induced heating technology for Pb-free solder joints of advanced multi-semiconductor packaging” was published by researchers at Sungkyunkwan ...

The semiconductor fabrication materials market is entering a decade of accelerated growth, driven by the convergence of ...

Packaging is now a performance variable. Substrate, bonding, and process sequence determine what can be built at scale. Warpage underlies most advanced packaging failures and gets harder to control as ...

"As chipmakers look for new ways to improve system performance beyond traditional device scaling, advanced packaging has become a critical area of innovation," said Clark Tseng, Senior Director of ...

TSMC is accelerating the expansion of its advanced packaging production capacity in response to the growing demand for ...

India aims to turn semiconductor dependence into industrial strength, with a new roadmap targeting a USD 150 billion chip ...

Looking beyond advanced logic nodes, compound semiconductors have emerged as a strategic priority for applications ranging from power electronics and RF to optoelectronics. Some subscribers prefer to ...